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what is the thickness of each layers of 4 layer 0.062 inch?

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liletian

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Hi Guys
I am thinking to use advanced circuit (4pcb.com) service. However, I can not find info on each layers. If anyone can give me a link or supply info on thickness of each layer, it will be greatly appreciated.
I found the following info on the website.
4-Layer PCB - 0.062" finished thickness

Layer 1 - Copper - 0.0014" thick (1 oz. copper weight)
Laminate (prepreg) - 0.0115"-0.0129" thick - Dielectric Constant of 4.6
Layer 2 - Copper - 0.0014" thick (1 oz. copper weight)
Core material - 0.028" thick - Dielectric Constant of 4.7
Layer 3 - Copper - 0.0014" thick (1 oz. copper weight)
Laminate (prepreg) - 0.0115"-0.0129" thick - Dielectric Constant of 4.6
Layer 4 - Copper - 0.0014" thick (1 oz. copper weight)

Please comments how accurate it is. I added all the layer's thickness together and found it is less than 0.06 inch.
thanks
 

It is probably easier to contact the PCB company to get the question answered, but there is no solder resist mask on those thicknesses.

Keith.
 

sTACK UP FOR 4 layer 0.062 in

Hi
it is possibel and very easy to make the stackup for 4 layrs

please look at this picture in file attached

Regards.
 

Better to get from fabricator only due to tolerances etc
 

Re: what is the thickness of each layers of 4 layer 0.062 in

I added all the layer's thickness together and found it is less than 0.06 inch
Yes, thats's reasonable, it's a pretty standard PCB stackup. What's your question with it?

For tolerances, the manufaturer will refer to IPC standards. You can expect a tolerance of about 10%
for finished thickness. If you need higher accuracy, e.g. for direct connectors, you have to negotiate
it with the manufacturer. Possibly not an option for pool production.

For a more exact answer, the copper specification of the outer layers has to be corrected most likely.
They are typically composed of a 1/2 oz (7 mil) or even thinner foil and the additive galvanization. Their tolerance will be higher than of a premanufactured foil, also varying with the copper area distribution.
 

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