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Stack Up & Via Combinations

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bert_kak

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Attached here is the chip that I'm designing right now and I need some suggestion for layer stack up that I can use for this chip & blind & buried via layer combinations. Thank you.
 

You probably want to use a blind buried layer stack using the following for fanout:

hole size 5mils +2/-5
Pad size 11.81 mils

For buried you can use whatever is reasonable.

eda
 

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