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How to model package & bondwire with r,c,l in spice netl

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joskin

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simple bondwire model

Because of the large current of power amplifier,I want to run the simulation with package & bondwire parasitic parameter.
But I wonder how to model the parasitics?Could anyone offer some exampls?
Thanks!
 

to model package

what type of paracitic do you want to model? the whole design of power amp or just the package & bondwire parasitic parameter?

make sure you have the full list parameter for the package because it is easier if you have it. A full package always inlucde the list and also it's model. Your job is to manipulate the parameter to what type of model calculation do you to get..

if you don't have the full parameter, try to search in the internet...
 

spice package models

This is a simple model, and you can refer.
 

Re: How to model package & bondwire with r,c,l in spice

for power amplifer design, you should using package & bandwire model in simulating.
because you need adjust the output impedance (impedance matching)

chip test doundry would offer you package model.
 

Re: How to model package & bondwire with r,c,l in spice

If I interpret your question correctly,
most vendors have IBIS models for your simulation.

you may create your own if it is not available though I would admit
it is very tedious job.

:)
 

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