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the size is not big enough to place all pads- need help

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handsome

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die size staggered pad

Hi,all
In my project, die size is not big engouth to place all pads which use wire bongding.
How can I slove this problem?I dont want to add the die size.
Thx.
 

die size and pad numer

Use staggered pads instead of inline pads if you have them. Use flip chip instead of wire bond.
 

die size and pad numer

jbeniston said:
Use staggered pads instead of inline pads if you have them. Use flip chip instead of wire bond.
Click to expand...

Thx.

I have used staggered pads.

Flip chip will need more money. And I am not familiar with the FC‘s backend flow。

Can you tell me the difference between the nomal wire bonding PR flow and the FC's PR flow?

Added after 1 minutes:

Can anyone explain the "multi tier packages"?
 

Re: die size and pad numer

Hi,

staggered pad approach is the good one. u can also use radially staggered pad placement.

thanks..

HAK..
 

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