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layer stackup model in HSPICE

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I am doing SI simulation using HSPICE. the topology is as follows.

Driver (ASIC) --> PCB trace --> Receier (ASIC).

Total number of layers in PCB: 12

I need to use stripline for simulation.

Right now i took inner 4 layers (GND, SIGNAL, SIGNAL, GND) only to model the PCB trace. I am using field solver to model the trace.

Is it correct method or do need to define all (12) layers in the stackup and mention X,Y coordinates of the trace.

Thanks in advance
 

It is the correct method for a quick simulation, I would recommend to add the via models as well. If you want a more accurate (complex) simulation, you should try a Design Of Experiments (DOE), the ibis models have 3 types of wroking situations (min, typ, max), plus the transmission line has a tolerance (it depends on the vendor, typically ~15%), and if it is a bus, you have also a length variable and aggressors.
I would go with just the ibis (both driver and reciver) and the impedances tolerance (typ, +tolerance, -tolerance), I mean 9 simulations (not that much :D), one for each combination. you will get 9 different results, and you are covering more situations.
 

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