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is there a difference between esd and pads or they are two n

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mohamedabouzied

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Re: is there a difference between esd and pads or they are t

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mohamedabouzied

Added after 23 minutes:

is there a difference between esd and pads or they are two names for the same thing?

thanx
mohamedabouzied
 

Re: is there a difference between esd and pads or they are t

I/O Pads are 3 types, in out and inout. Pads contain ESD protection arrangement to protect from the external environment. Refer Chapter-11 in "Kang" you will get some idea.
 

PADs are used for chip to bonding with the package,they are just simply a wider Metal (with well under them)
while ESD circuits are designed for struggle with ESD failure.
"The Art of analog layout" must also mentioned both of them.
 

i agree with DZC

the PAD is just a wide metal to connect the bond wire
the ESD circuit is a circuit added just after the PAD to protect the circuit form the ESD failure , both should be optimized for RF applications , coz th ESD is mainly a diodes which will add some capacitance to the RF path

khouly
 

Re: is there a difference between esd and pads or they are t

Esd is for discharge electrions and Pad is I/O.
They are different .
 

Re: is there a difference between esd and pads or they are t

Every pad got ESD protection .
 

Re: is there a difference between esd and pads or they are t

In my opinion,PAD includes ESD and a big metal plate,the metal plate is where the bonging wire (connecting the die to the package) soldered on;the ESD is protect the die from Electrostatic discharging that will destroy the whole chip.
 

Re: is there a difference between esd and pads or they are t

PAD - Wide metal which is drawn in top level met layer
ESD - Its a king of effect
PIN - which is a interface for external world

In most of the cases PAD is connected to the PIN through bonding wire, so it means PAD is the First point to get the external inputs

So if there is any ESD on to die it has to come through the PAD, thats why every PAD comes with ESD protection circuit to avoid chip failures
always both will come together but both are not same.

I Hope u got some Idea.
 

Re: is there a difference between esd and pads or they are t

Chap,

It's time to give some brief idea about IO's.

Generally an IO is for Input Ouput inerface reason. These generally calssified as Power Pads and Signal pads. (i.e Power IO's and Signal IO's)

In an Power IO we will be having three sections.

1. Clamp ckt
2. ESD ckt
3. Bond Pad (where we will instantiate a pin in packaging)

In Singnal IO's also you will three sections.

1. Digital ckt.
2. ESD ckt.
3. Bond pad (where we will instantiate a pin in packaging)

And These Bond pads are several types...like CIU pads and Bump pads etc.

So it's no clear that what is IO , ESD and Pad. If you need any more info you can come up with.
Please correct if I am wrong any where. Thank You.

Varma.
 

Re: is there a difference between esd and pads or they are t

varma_cs012 said:
Chap,

It's time to give some brief idea about IO's.

Generally an IO is for Input Ouput inerface reason. These generally calssified as Power Pads and Signal pads. (i.e Power IO's and Signal IO's)

In an Power IO we will be having three sections.

1. Clamp ckt
2. ESD ckt
3. Bond Pad (where we will instantiate a pin in packaging)

.........
what 's the difference between clamp ckt and ESD ckt?
thx!

Added after 1 minutes:

prcken said:
varma_cs012 said:
Chap,

It's time to give some brief idea about IO's.

Generally an IO is for Input Ouput inerface reason. These generally calssified as Power Pads and Signal pads. (i.e Power IO's and Signal IO's)

In an Power IO we will be having three sections.

1. Clamp ckt
2. ESD ckt
3. Bond Pad (where we will instantiate a pin in packaging)

.........
what 's the difference between clamp ckt and ESD ckt?
thx!


what 's the difference between clamp ckt and ESD ckt?
thx!
 

Re: is there a difference between esd and pads or they are t

not all clamp ckt are used as ESD protection ckt. ESD are usually clamp ckt.
 

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