10 layer PCB stackup for high speed signals

10 layer stackup

Hi eveyone,

Can anybody suggest a suitable 10 layer stackup for high speed signals.

And also which are the layers to be used to route high speed signals.

Thanks in advance.

You can see the details from the following link:

http://www.hottconsultants.com/techtips/pcb-stack-up-5.html

tnks asifrehmat for the link.

that's a lot of ways. Welcome to contact us.

Added after 5 minutes:

L1 singal

L2 GND

L3 Signal

L4 Signal

L5 GND

L6 GND

L7 signal

L8 signal

L9 GND

L10 signal

the above is a typical method. Anyway, your design idea is very import. Please keep the stackup as a symmetrical structure.

If you can tell us some parameters, such as total thickness, signal/GND distribution, whcih material you are preferred. Our engineer could get it out very easily.

flypcb said:

that's a lot of ways. Welcome to contact us.

Added after 5 minutes:

L1 singal

L2 GND

L3 Signal

L4 Signal

L5 GND

L6 GND

L7 signal

L8 signal

L9 GND

L10 signal

the above is a typical method. Anyway, your design idea is very import. Please keep the stackup as a symmetrical structure.

If you can tell us some parameters, such as total thickness, signal/GND distribution, whcih material you are preferred. Our engineer could get it out very easily.

Click to expand...

Where is the POWER planes?

sorry, but from our manufacturing side, Pwr and GND are basically the same thing. Since both of them are inclined to increase copper area up to 80% or so. We care this point very much due to warp&twist issue and laminate as well.
In general, we use "PWR/GND" instead of a simple word "PWR" or "GND" in stackup.

Thanks for your pointing out my mistake.

normally what i follow is that i keep clks and high speed signals in between ground layers...

we route non critical signal on the top and bottom layer

we provide immidiate ground layer from component side so that the switcing noise from the components does not effect the high speed signals which are routed in the inner layers...

Hi,

Check this link below,it will be very useful for your refernces...

This will be your ideal layer stackup,and it gives up the closely spaced power/ground plane pair,if you observe you will see all high speed signal are between the ground and power and acts like shielding for the critical signals.


________________Signal (low-speed signals)
________________Gnd.
________________Signal (high-speed signals & clocks)
________________Signal (high-speed signals & clocks)
________________Pwr.
________________Gnd.
________________Signal (high-speed signals & clocks)
________________Signal (high-speed signals & clocks)
________________Gnd. or Pwr.
________________Signal (low-speed signals)

http://www.hottconsultants.com/techtips/pcb-stack-up-5.html


Hope this helps you...


Regards,

Ramesh

Hi Everyone,

Thanks for your reply.

Will get back in case of any clarifications.

Hi all,

Is ther any difference with these Stack Up....

________________Signal (low-speed signals)
________________Gnd.
________________Signal (high-speed signals & clocks)
________________Pwr.
________________Signal (high-speed signals & clocks)
________________Signal (high-speed signals & clocks)
________________Gnd.
________________Signal (high-speed signals & clocks)
________________Gnd. or Pwr.
________________Signal (low-speed signals)

:idea:

If you used Stack ups above, when you route you should attention about crosstalk signals.

Do you really need 10 layers? If not for those BGAs.
Most of the motherboard are designed less than 10 layers.

One really easy way to get information on 10 layer stack would be to consult with your fabrication house.