+ Post New Thread
Results 1 to 3 of 3
  1. #1
    Member level 3
    Points: 463, Level: 4

    Join Date
    Jan 2017
    Posts
    66
    Helped
    0 / 0
    Points
    463
    Level
    4

    Why cant we make connections on a wafer from the sides, why is it only from the top ?

    Why cant we make connections on a wafer from the sides, why is it only from the top ?

    •   Alt20th October 2017, 17:02

      advertising

        
       

  2. #2
    Advanced Member level 4
    Points: 5,380, Level: 17

    Join Date
    Apr 2016
    Posts
    1,131
    Helped
    202 / 202
    Points
    5,380
    Level
    17

    Re: Why cant we make connections on a wafer from the sides, why is it only from the t

    A typical circuit has a seal ring around. That seal ring uses all metal layers. So there is no way to effectively reach the edge. Plus, edges are really rough after dicing. That signal wouldn't be able to go anywhere reliably.

    If you are talking about uncut die, then yes, it is possible to connect multiple dies on the same wafer. It's not typical though, would require a foundry to play along. Which they will not do.
    Really, I am not Sam.



    •   Alt20th October 2017, 19:47

      advertising

        
       

  3. #3
    Advanced Member level 5
    Points: 34,958, Level: 45

    Join Date
    Mar 2008
    Location
    USA
    Posts
    5,594
    Helped
    1631 / 1631
    Points
    34,958
    Level
    45

    Re: Why cant we make connections on a wafer from the sides, why is it only from the t

    Through-silicon via (TSV) processing either BEOL or
    post-fab can get you access through the backside.



--[[ ]]--