T
treez
Guest
Hello,
Do you agree that thermal vias to go in and around the pads of a D2PAK FET on an FR4 PCB should be no more than 0.35mm in diameter? I am speaking of non-solder-filled vias and PCB with 70um copper thickness.
Also, for those thermal vias that are around the D2PAK (ie not underneath it), they should be no closer than 1.7mm to each other (centre to centre of thermal via).
(The product is an offline 150W LED driver.)
Do you agree that thermal vias to go in and around the pads of a D2PAK FET on an FR4 PCB should be no more than 0.35mm in diameter? I am speaking of non-solder-filled vias and PCB with 70um copper thickness.
Also, for those thermal vias that are around the D2PAK (ie not underneath it), they should be no closer than 1.7mm to each other (centre to centre of thermal via).
(The product is an offline 150W LED driver.)