sh-eda
Member level 1
I'm wondering if I can get some help interpreting a part of the ATEX standard (IEC 60079-18)?
I am designing a PCB for ATEX certifcation, encapsulated type 'mb'.
Under 7.4.3.2 'minimum distances' (page 23-24) there is a table (5) and diagram (figure 2) of the PCB stack-up.
In my case, from the diagram and text it basically states that,
The minimum distance between a conductor on any layer and the edge of the PCB or any hole should be at least 3mm.
If the edges or holes have 1mm of metal or insulation protection extending at least 1 mm along the surface of the board
from the edges or holes, the distance between the conductors and the metal or insulation material may be reduced to 1mm.
1. What is this to protection against? Physical damage?
2. Does this apply to every hole? Including via plated holes for through hole plated components?
Thanks
I am designing a PCB for ATEX certifcation, encapsulated type 'mb'.
Under 7.4.3.2 'minimum distances' (page 23-24) there is a table (5) and diagram (figure 2) of the PCB stack-up.
In my case, from the diagram and text it basically states that,
The minimum distance between a conductor on any layer and the edge of the PCB or any hole should be at least 3mm.
If the edges or holes have 1mm of metal or insulation protection extending at least 1 mm along the surface of the board
from the edges or holes, the distance between the conductors and the metal or insulation material may be reduced to 1mm.
1. What is this to protection against? Physical damage?
2. Does this apply to every hole? Including via plated holes for through hole plated components?
Thanks