rf_enthusiast
Junior Member level 1
Hi all,
We are trying to make a 4-layer PCB for 5.8 GHz power amplifier application. The circuit has been verified on a two layer board, but to take care of better connectorization, we are going for 4 layer board.
Here we want to have the following stackup:
+ Top layer and Mid layer1 from RO4003C 20 mil PCB
+ Mid layer2 and Bottom layer from FR4 20 mil PCB
+ Prepreg layer of FR4 of thickness 20 mil in-between the two PCBs.
The problem is that FR4 and RO4003C have very different Tg (glass transition temperature); FR4 has Tg of 150 degC and RO4003C 280 degC. Will this result in any board reliability issue during manufacturing or during operation? Any help on this is most welcome.
Thanks in advance.
We are trying to make a 4-layer PCB for 5.8 GHz power amplifier application. The circuit has been verified on a two layer board, but to take care of better connectorization, we are going for 4 layer board.
Here we want to have the following stackup:
+ Top layer and Mid layer1 from RO4003C 20 mil PCB
+ Mid layer2 and Bottom layer from FR4 20 mil PCB
+ Prepreg layer of FR4 of thickness 20 mil in-between the two PCBs.
The problem is that FR4 and RO4003C have very different Tg (glass transition temperature); FR4 has Tg of 150 degC and RO4003C 280 degC. Will this result in any board reliability issue during manufacturing or during operation? Any help on this is most welcome.
Thanks in advance.