Continue to Site

Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

Register Log in

How to detect broken wire bond in a multiple wire bonding?

Status
Not open for further replies.
R

rikie_rizza

Full Member level 6
Joined
Aug 5, 2006
Messages
331
Helped
29
Reputation
58
Reaction score
8
Trophy points
1,298
Location
Bikini Bottom, between a rock and a pineapple
Activity points
3,173
Hi All,

How to detect broken wire bond in a multiple wire bonding?
If in one pad and one lead have more than 1 wire bond, how to detect if one of them are broken? The detection should use DCVI instrument or ATE (non xray or things like that).

Please help
 

If you had a segmented driver then the effect of a missing
bond wire would be obvious because it would show the Ron
degradation. If you have a slab on both ends then all you
can see is the delta bondwire resistance, less than 0.1 ohm
most likely.
 

Failure analysis company provide X-Ray services for this check.
 

The problem was the same pad and the same lead on both end of the wire bond.
We cannot use xray observation since it will took a long time to finish. That is why i'm thinking to implement a test in the test program that can detect this tiny changes. If the resistance is 0.1ohm, then it would be obvious if something missing. The problem is, the order is only in 10uOhm while the tester sensitivity is 1mOhm. Is it possible to check it by frequency or stuff like that?
 

The bondwire resistance / inductance is 0.1 ohm and 1nH
(say) but that's in series with something else before you
get to any other pad. There's the rub.

If you have enough current capability to fuse a single bondwire
then you could overtest the output and if it survives, it must
have had two ;)
 

Men youre good...you're right we can fuse it, we dont want to use it anyway. After I measure the RDS(on), I will apply some number of current up to its max rating just to blow the bonding if the amount is not sufficient. I got this feeling that some how this will not work. ;)
 

Status
Not open for further replies.

Similar threads

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Back
Top