Hello to everyone !

I think this was the best suited forum for my post...if not, please let me know.

I am trying to simulate the behaviour of a copper trace working as a heatsink, where an array of powerLEDs is soldered.

In order to make simulations, i am using CST EM 2009 because of several reasons:

· it can import PCB info from my EDA tool with no problems
· It can use the 3D model of the LED (step, igs...) and change material properties in a straightforward way.
· it can perform co-simulations with both stationary current and thermal solvers

The initial idea is to place the 3D models over the imported PCB, and after that to follow the steps that are described in the help, I mean:

Define electric and thermal material properties
Define electromagnetic and thermal boundary conditions.
Perform a model intersection check for thermal and electromagnetic problem types.
Run the electromagnetic field solver (Stationary current).
Specify the loss-fields for the thermal simulation.
Select if surface-losses should be taken into account.
Run the thermal solver.
Analyze the thermal results.

(I have also read the tutorials that are on the help, and the avalaible examples on the showing room at WWW.CST.com)

...It seems to be easy, but everybody knows that good simulation results are in some way a "non written skill" which will only be improved day by day through experience.

So at this point: Any idea or suggestion or even a similar example with CST...? Will be very wellcome.

Thanks so much for your attention.
Best regards