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The PCB will have 16 Layer in total.
About the tolerance I have read only this requirements:
"The data signal traces should be designed for controlled impedance. Single ended signals are 50 Ohm and LVDS signals are 100 Ohm differential."
Hello!
I am confused about the correct PCB stack-up for 100 Ohm differential trace impedance.
Can you describe me the basic rules for this and advise relevant links?
For example, I have differential stripline signals, which should be 100 Ohm impedance.
Dielectric thickness may vary, but at the...
I need to configure one FPGA and two Platform Flash memories.
I have found the following example: UG161.pdf, page 44, Figure 5-1.
There are two FPGAs - Master and Slave. But I am going to use Master FPGA only.
How changes the configuration setup in my case? Or I can simply ignore Slave FPGA in...
I need to have some resistors with no thermals, and the same decal resistors (in another place) with thermal relief. So I guess I cannot change the padstack of decal because it will be changed for all resistors. Am I right? So the only solution I have is to use COPPER not COPPER POUR. Yes?
My problem is that I have some area of my design on Top Layer which should be "flooded over" with copper and the rest area of this layer should be GND filled using thermal relief. When I press "Flood All" in Pour Manager, it fills everything using the same connection (flood over or thermal...
How can I replace decal with two pads if the footprint has one pad for signal and four pads for GND?? I cannot change the number of pads for the footprint of the component I am going to use...
Unfortunately, when I try to name these four pins the same in PCB Decal Editor, the PADS Layout does not allow me to do this and an error appears: "Alphanumeric name is already used."
I guess I am using another version of PADS...
What should I do?
I am using DxDesigner and PADS Layout. I need to make a symbol for coaxial SMA jack, which has one signal pin and 4 GND pins.
In Layout I have 4 separate pins for GND but in Schematic I need to draw a symbol with one center (signal) pin and one outer (GND) pin.
So for GND I have one pin in...
The amount of signal layers depend on routing the breakout of BGA.. I need to use as fewer layers as possible. At the moment I have 4 inner signal layers.
In my project I need to connect FPGA (1156-pin BGA) with 204-pin DDR3 memory. I am confused, because there is a small area under BGA for big amount of signals. 11 raws of BGA are used. I am using PADS Layout.
Is there any helpful technique to set the pins in DxDesigner in more logical way in...
Footprint with exposed pad (PowerPAD)
I am using PADS Layout. I what to know how to make the fooprint of TPS51200 correctly. It has an exposed power pad. I have read that this pad should have vias connecting to GND. Do I need to add these vias as terminals in PCB Decal Editor during making the...
I have associated narrow thin copper shape with one pin of IC and the shape became correct! Now I have another question, how can I create solder mask with the same shape as copper?
Hi All,
I am using PADS Layout software. I need to create a footprint for TPS51200 regulator.
On the page 34 of its Datasheet (it is attached) an example board layout is shown. "Non Solder Mask Defined Pad" shape is suggested, but I do not know how to make it in PADS PCB Decal Editor. Is it...
I am using PowerPAD at the first time (for TPS51200 voltage regulator). Am I right that the Solder Mask should not be present over the area of the exposed thermal pad of IC?
One more thing, PowerPAD vias should be added to the footprint itself or during the routing the design?
If you have same...
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