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I need to route 50 ohm signals on an 8 layer board. To keep the impedance at 50 ohm I need to calculate the trace width on all the layers.
I have found Polar instruments si8000. But is there some free software that I can use?
What program do you use to do this?
On my board i have ground and protective earth. Protective earth is only connected to the mounting holes of the board, it is not connected to ground.
Is it wise to have a separate plane for the protective earth to connect all mounting holes together?
Or is is bad to have protective earth go...
I have found this document (it has the same picture I found with google) :-)
Figure 1a is the best way he says.
http://www.sigcon.com/Pubs/news/9_07.htm
But what happens if you move the capacitor (in figure 1a) closer to the pin so both vias is on the same spot? This would be the best if it...
I need a serial SRAM connected to SPI (I hope). I need to buffer many sample values. The sample values need about 8MBit.
I need to buffer the sample values before sending them. The transmit link is slow.
Any tips for an SPI based SRAM? Or a FLASH with many write cykles?
Hello
I need to calculate the slope of a temperature (Kelvin/s) from a temperature sensor.
The solution today is an Kalman filter with static kalman gain. This filter gives wery smooth derivative/slope. But it causes a phase shift of the derivative.
I don't know how to fine tune the Kalman...
I don't mean when I define the component. I mean when I place it on the layout.
If I have define a small solder paste mask for the top layer it is defined as big as the default if placed on the bottom layer.
If I define an SM pad that has a default, solder paste top and solder resist top define. And when I use it as a pad to an SM component CADSTAR doesn't handle the swapping correctly when placing the component on the bottom layer.
I also need to define solder paste bottom and soldel resist bottom...
Is it safe to route through a SMD pad or should I always make a T connection to the pad?
And when is it safe to connect SMD pads withoud thermel thermal reliefs? Is it ok for 0805 but not for smaller packages? I often see evaluation boards for DC/DC converters that connects decoupling...
I have calculated the correct width of a trace to give it a 50 ohm impedance. But how near the 50 ohm trace can I do a copper fill so I don't effect the 50 ohm impedance?
What is the easiest way to insert double vias when changing route layers?
If I for example route power supply and change routing layers then I would like to have two vias inserted instead of only one.
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