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Re: Trench Construction
Very quick.
-mask
-plasma etching
-fill with SiO2
-fill with polysilicon
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A deep trench is like a wall, it prevents parasitic currents making the chip less sensitive to LU. STI has no effect on LU.
Son.
This image shows the difference between wire bond and solder bump packagings. In the later case one says it's a flip chip: the chip is up side down.
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Multifingering looks ok. Use metal for wiring as far as it's possible. The poly gate doesn't need multiple contacts. For drain and source metallization, follow electromigration rules.
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