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Layer SatckUp depends on :
-Board Application (RF, Analog, High speed..etc)
-Complexity of the Circuit
-signal integrity
-Impedance of the traces
you can use AapCad for the calculation of the RF Board Stack up
click here for AapCad
AppCAD
Yeah.. u need to add 4 extra pads.... what do u want to design symbol or footprint.?... it always better to do new footprint rather than editing... in orcad you can use pad array generator... it will simplify process of designing the footprint...
changing footprint from SSOP-24 to SSOP-28. you just need to add the two extra pins. it can be done in library manager option in Layout plus....
follow below procedure..
Layout Plus->tools->Library manager, library manager window will open...here u can change the footprint...open the SSOP-24...
I have design the board with RF/ANALOG and Digital section. I have used same ground plane for all sections..and board is working fine... i will suggest u to separate RF and other low frequency parts...Refer below link...
**broken link removed**...
for through hole plz check this part.....
**broken link removed**[2005.06.30%2009.58.29].pdf
check the part image....
---------- Post added at 15:09 ---------- Previous post was at 15:04 ----------
u can also check this part for through hole
Digi-Key - A97594-ND (Manufacturer - 5-1814832-1)...
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