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Hi, We provide the substrate thickness and permittivity value during the rectifier design in the advanced design system. The substrate's length and width are not specified. Do the length and width of the substrate affect the rectifier performance?
In my design, I have kept the edge of the...
Thanks a lot, @BigBoss. Sorry, I'm not very clear here. Do you mean that the fabricated model will have a ground plane?
How to create an outline (length and width of the substrate) for this circuit and how much space should I keep between my design traces (on cond layer) and the edges of the...
Thanks, Klaus for your response. I am using Keysight Pathwave Advanced Design System software. I have attached a screenshot for exporting the Gerber file and the exported layers.
Hi, I am exporting a rectifier for fabrication. The Gerber file of my design does not contain a ground plane when exported. Does the ground layer need to be manually added to the layout based on my substrate setup? I think the design need a ground plane in this case especially when we have VIAs...
Thanks a lot, @BigBoss. I used ViaGnd it seems better. As shown in the screenshots above, do I still need to ground the short stub manually? In the schematic, we can't connect via to a short stub.
Thanks a lot, volker@muehlhaus. There was an extra gnd symbol I removed. The attached screenshot shows how I got gnd symbol. To further assess whether my setup is appropriate, I would like to share anything else you may need to know? I really appreciate your help.
I am working on a rectifier. There is a difference in the layout and schematic simulated result (S11 plot attached). I know that the layout result usually differs from the schematic. Is it normal to have this much of a difference in the S11 plot as in the screenshot attached? The layout...
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