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Recent content by muldersun

  1. M

    How to calculate the transient power disspation by Hspice?

    hspice power dissipation Usually, I use 'average' in switching-power supply. You can print the power directly in HSPICE. .print tran p(??) power This is transient power. If you want to get average power, you can use this command: .meas tran p_avg avg p(??) from=?? to=?? Normally, the...
  2. M

    how to save a bad bandgap after tape out?

    Attached file is simple principle circuit. It is only for trim-up. Original value is lower than you want. Example: The bandgap voltage is 1.25V, the original value maybe 1.15v. Red rectangle is trim PAD. Red line is top-level metal we called burned-fuse. Burning the fuse between 1 and 2, you...
  3. M

    Why using Dual input PAD

    You can calculate using following method: v=L*dI/dt, So, when dI/dt is large enough, the delta V is not neglected.
  4. M

    how to save a bad bandgap after tape out?

    As I know, the common bandgap circuit need trimming circuit. The circuit offset, layout mismatch, process variation, these factors can affect the precision of bandgap voltage.
  5. M

    How to simulate the output resistance of op-amp by hspice?

    How to simulte the output resistance of op-amp by hspice? I have tried this method, I think it's right. You can reference: 1. Connecting your OPAMP to buffer structure. Run .TF, you can find the output impedance. It's very small, because it's close loop output impedance. 2. Changing...
  6. M

    anyone very familiar with hspice? help on DC measure please!

    what x means in hspice .DC V4 0.4 0.8 0.001 .MEAS DC VLH TRIG V(BGP_RDY) AT=0.4 RISE=1 TARG V(BGP_RDY) VAL='0.1*VS' RISE=1 .DC V4 0.8 0.4 -0.001 .MEAS DC VHL TRIG V(BGP_RDY) AT=0.8 FALL=1 TARG V(BGP_RDY) VAL='0.9*VS' FALL=1 .MEAS DC VHYS PARAM='VLH+0.4-(0.8+VHL)' This is my file for measure...
  7. M

    Offset in Post-layout simulations

    transient post simulation? Maybe it is a measurement error because of the delay time.
  8. M

    Why do we do dummy metal filling in layout?

    dummy metal filling I think it is used to flatten the surface of layout.
  9. M

    How to add temperature sweep in tran simulation?

    ac analysis sweep temperature How to do? Can you give us detail description? Thanks!
  10. M

    how to connect the plates of dummy capacitor?

    Connect to rail I think floating is not good
  11. M

    mos difference of parallel-series and series-parallel

    I think there are some differences in AC characteristic, but the same in DC.
  12. M

    problem ON ANALOG CMOS circuit!

    From your netlist, I thinks it is only used to simulate. Depend on your application,you should know the requestion, you need to trade off. About OPAMP,you can read Allen's book first.
  13. M

    The difference between N substrate and P substrate

    I think two points: 1.Using N sub. The PMOS and NMOS are matching better.The NMOS's mobility is about 2-3 times PMOS's in P sub process.But using N sub process, we can decrease the difference 2.Yout circuit need special NMOS,such as large current NMOS.Using N sub,we can isolate the NMOS and...
  14. M

    Why tail transistor need to be in saturation region?

    If you want to get a right AC result,the current source must be constant.
  15. M

    Over temperature Protection circuit.

    This circuit is normally in many IC deisgn,but you need to add the hysteresis circuit

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