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Recent content by Michael Chiang

  1. M

    help Back end digital ASIC design

    Hi, MPW mean you could put different chip in one mask. The purpose is to save mask cost in the design debugging stage. Normally faundry site will provide this service.
  2. M

    Info on min/max die pad sizes and spacing requirements

    Re: Die pad question.. Hi, You should reference the design rule from your fab supplier an dbonding design rule from your assembly supplier. Both of them should be match otherwis you will meet problem in manufacturing.

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