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Hello,
I want to add in my design a chip (ceramic) antenna in Sub-1GHz, for the TI's CC1310.
Johanson technology offers for this chip a simple solution.
https://www.johansontechnology.com/datasheets/antennas/0900AT43A0070.pdf
I can't understand, what is the trace element for?
So there's not me who see that the exposed pad has too little solder paste in contrast to the others package's pads. Eventually I figured out that there was not good idea to tent the vias, but how can we prevent the solder flowing through the vias if these aren't tented? How could I do that in...
I read once that the solder paste must be placed carefully in a way that it does not flow through the vias.
And I thought that if I placed solder mask on the vias it would stop the solder flowing. But unfortunately I follow the same thought on the stencil as well.
In a prompt search on the...
I made a pcb with a QFN32 with exposed pad but I feel like I've made a mistake on the stencil, in the exposed pad area. I managed to solder it and the chip (CC1310) is programmed successfully but I'm still concerned about the stencil. The solder paste looks like a chess on the exposed pad and I...
Hello, I've been designing a pcb with an RF chip.
There's a few polygon pours around the board and I want to place another one, a whole Ground, over the whole board to fill the rest gaps.
I set the polygon's order to lowest, because it's over the rest polygons and everything looks good. Gaps are...
This is a simple breakout board based on TI's CC1310.
It's a single chip cost-effective and ultra-low power solution of sub-1GHz and intended for IoT applications such as buildings automations and robust data broadcasting.
Incorporating a powerfull ARM Cortex-M3 up to 48MHz, a complete RF...
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