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Re: Solid Ground plane
I am using the following 6 layer stackup for a wireless system module design based on a reference chipset in 2.5 Ghz and the layout recomendation is to have a solid ground plane as ground for digital,analog sections
TOP 0.05 mm copper foil+copper plating
DIELECTRIC...
Is this 6 layer stackup good for doing reference designs based on wireless chipsets in the freq range of 1-3 Ghz.
TOP 0.05 mm copper foil+copper plating
DIELECTRIC 0.1016 mm 4 mil Core
LAY2 0.035 mm 1 oz Solid Ground
DIELECTRIC 0.1016 mm 4 mil PrePreg
LAY3 0.035 mm 1 oz Digital...
Hello,
For a mixed system wireless system design based on a mixed signal chipset the suggestion is to use a solid ground plane for analog and digital grounds. What considerations has to be considered/implemented in doing so for a six layer stack up
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