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Hi All
I am familiar that MIM cap can be placed on SUB or NW.
In IBM 0.18 they give a third option for the backplate, which is BB layer.
Does anybody know what is this BB layer used for and any pros and cons?
Thanks!
Dear All,
I have XUP Virtex II pro kit (https://www.xilinx.com/univ/xupv2p.html).
But it doesn't contain high speed data converters.
I am looking for a DAC module in the order of 100 Msps.
The question is: where can I find it? and how can I connect it to my FPGA?
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