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Thanks for your time dick_freebird.
I have one more doubt..
I know that The fab has specific rules for fabricating IC s which have to be met by the design engineer ,one such rule is METAL DENSITY RULE
The IC(say Ic with 2million transistors) with more number of transistors has more metal...
Automatic insertion of metal to meet the metal
density rules as specified by a foundry for a given
placed and routed IC in 28nm process is my project as of now.
And I need to know certain stuff as I have no idea..
1) Why do we prefer ASIC and
full-custom designs rather than FPGA ?
2) I need...
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