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tent via holes
this exposed pad is quite big wrt footprint area... its supposed to dissipate heat and short connect to ground... hence suppliers are always mentioning these vias or feedthru holes as a matrix under the pads... so anythign that jeopardizes the low impedance or thermal dissipation...
tenting a via
Thanks for the replies... i will do as you say Buenos.. i was being lazy but again according to FVM, i think this tenting is not so sure... so im trying this comrpomise: let the solder wicking occur and close via from bottom layer..
tenting of vias
Hi
i wonder if someone can help me on this topic: i have a via-in-pad, the type you put on exposed pad lands and connect to ground layer and i am using Allegro package designer. so i need to plug those vias to avoid wicking during soldering of the component: In allegro...
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