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They are aligned so no need to offset them. I would, however, put the board outline (a thin line showing the boarder of the board) on all layers so the fab house can use it to align files if they need to.
https://www.anaren.com/sites/default/files/XC0900A-05%20Data%20Sheet%20Rev%20D.pdf
Xinger II from Anaren will do the same thing.
They are pretty good about responding and giving out samples.
pin to pin comparable as well.
The pads are used to build up the isolation between the 2 sig gens.
The goal is to have a cleanest combined sig ( 2 tones) with no IP3 product. However, having too much pad will force the sig gen to work harder to compensate for the pads -> more harmonics.
I use isolators whenever I can instead...
It is called "solder mask" and the main purpose is to keep solder where they belong during SMT reflow process.
Without solder mask, the solder will spread and flow away all over the copper and either create shorts or open solder joints (insufficient solder) during the SMT reflow process.
The...
I use CAM350. However you can just email the fab house who is making the PCBs for you and let them know which legends you want deleted.
Most fab house will do this at no cost.
Just place full vias so the board outline goes thru the center of the vias. No need for any extra note for the fab house.
They will fabricate the PCB exactly the way you design (what they see on the gerbers) - place the vias and route them so only half of vias are left.
A couple of things I see here:
1) L3 will generate back EMF which will fry U15.
2) C40, C29 C39 and C30 are grounded at different potential - not referenced to U15 = ground loop
If you are concerned about noise getting into P9, I would reverse the logic on the MCU
and keep only R24, C36, P9...
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