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As you said, there is almost no samples outside the spec. under TT conditions in processes managed by 3 or 4 sigma. (in normal mass production)
But, in corner run, which is optionally performed in the early stages of mass production, the distribution center moves from TT to SS or FF.
(I don't...
Thank you for your kind reply.
I understand that the process setup requires a lot of repetition and experimentation.
My question was about corner lot for new semiconductor products produced in mature process. (not for new process development)
There will be many IC samples outside the library...
When developing new semiconductors, corner lots are sometimes performed.
However, just as the process of the TT target forms a spread containing SS, TT, FS, SF,
the corner lot will also form a new spread that is not in the process library. (outer range from process model library)
Then, it is...
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