mohdfaaf
Joined: 26 Sep 2004
Posts: 23
Location: malaysia
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 23 Oct 2004 8:43 Re: CMP |
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As far as I know, CMP has become one of major / critical process for fab processing. CMP is done at various layers of processing. Therefore, your question is too general to begin with.
I know that you need to control the final thickness uniformity ( from center to edge ) across the wafer. Layer density has impact on the polish rate - thus will impact your circuit. Defects generated during the process and contamination are also being a concern.
In other words, there are many ways the CMP could affect your circuit quality and reliability. You should try to narrow down to which layer, layer density, CMP tool, process flow for more details.
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