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Answers to Interview Questions


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koggestone



Joined: 16 Oct 2008
Posts: 31
Helped: 2


Post16 Oct 2008 12:14   

interview questions set up hold time


This thread has answers to the interview questions at following thread
http://www.edaboard.com/ftopic331075.html


So please read above thread , before u read this thread.

-------------------------------------------------------------
1) As Temp increases ,
Mobility Decreases ,
hence dynamic current (Ion) decreases
hence digital gates run slower at Higher Temperatures

As Temp Increases ,
Vt (Threshold Voltage) Decreases,
hence Leakage current (Ioff) increases
hence Leakage power increases at Higher Temperatures

As a side note , the equation for Ion is
Ion = a . mobility . (Vgs-Vt)^b
note that as temperature increases,
- mobility decreases , which tries to decrease Ion
- Vt decreases , which tries to increase Ion
but the combined effect will effectively decrease Ion and hence digital gates runs slower at high temperature.
But with new processess like 45nm , where nominal Vdd is becoming Lower , and people are being more aggressive to decrease Vdd further to save power, the effect of Vt is bigger than mobility on Ion , hence at high temperatures , digital gates are running faster! . so have your standard cell libraries characterized for various temperatures and use appropriate corner for your STA runs depending on your targetted Voltage at which the block runs.

-----------
2) True

but with newer process like 45nm , and with lower Vdd than process recommended Nominal Vdd , Low Temperature (0c or -40c) is worst case corner instead of traditional High temperature (110c or 125c) .
refer to the answer for 1) above for more explanation.

-----------
3) True

----------

4) True

----------

5) Pros - Faster Gate delays
(since as tox decreases , cox increases , hence Ion increases, hence gate delay decreases)

Cons - Higher Gate Leakage , and Reliability Issues

to combat gate leakage , Intel's Future processes has High-K .
since cox is proportional to K/tox , to increase Cox u can increase K instead
of decreasing tox , hence your gate leakage is decreased.

----------

6) Tclk > Tclktoq + Tlogic + Tsetup + Tskew + Tjitter
Tclktoq + Tlogic - Tskew > Thold

key things to note from above equations
a) once the silicon comes back , if u have setup time problem , u can
increase the clock period (Tclk) to fix it , whereas if u have hold
time problem , its a more serious problem and u will need a new
metal fix tapeout .
b) PLL jitter (Tjitter ) is not used in holdtime equation , since hold
time violation is based on same clock edge . (whereas setup time
vioation depends on 2 consecutive clock edges)
c) above equaitons have clock skew in pessimistic directions . U can play
around with clock skews to get extra margin by skewing them in
favourable direction to decrease violation .
d)from above equations , u can easily answer questions like
"how do u fix setup violations ?" ( faster flop , flop with less setup time , smaller logic between flops , etc ...)
"how do u fix hold violations ?" ( use mindelay flop i.e flop with bigger clock to q , etc ... )

----------
7) Dynamic Power = alpha * C * V^2 * f
(actually the term V^2 is Vdd * Vswing)

so to decrease Dynamic power
a) decrease alpha (activity factor) - clock gating , data gating , reducing toggling of various nodes especially high capacitance nodes , etc ...

b) decrease C (Capacitance) - move to newer process (like 45nm) , smaller gates , smaller wires , ...

c) decrease V - note that power depends on square of V . Hence u get bigger bang for a buck by decreasing Vdd . hence operate blocks that have enough timing margin with lower supply voltages (voltage islands , ...) , low swing Logic ,etc ...

d) decrease f - operate blocks that have enough timing margin with lower clock frequencies (Multiple clock domains, ...) , etc ...

e) u can use Dynamic Voltage Frequency Scaling (DVFS) , by playing around with voltage and Frequency together .

---------

8 ) gate delay t = C . deltaV / I
( deltaV is the Voltage swing)

to decrease gate delay (t)
a) decrease C - reduce output loading (fanout) , newer process like 45nm , etc ...
b) decrease deltaV - reduce voltage swing , etc ...
c) Increase I - bigger transistors (bigger W) , smaller L , etc ...

note that reducing Vdd than process nominal Vdd increases gate delay bcoz
- deltaV decreases proportional to Vdd , hence tries to decrease t
- I decreases proportional to (Vdd-Vt)^a , where a is between 1and 2 , hence tries to increase t
the combined effect will increase t , i.e higher gate delay.


-----------------------------------------------------------


Last edited by koggestone on 17 Oct 2008 12:30; edited 18 times in total
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Post16 Oct 2008 12:14   

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viju



Joined: 26 Nov 2006
Posts: 60
Helped: 8
Location: Bangalore


Post16 Oct 2008 15:07   

Answers to Interview Questions


I would like to comment on your answer 2 and 3. It will be not the case, that you have mentioned when we go for 65nm....45 nm... its simply reveres for temperature than what you have mentioned...
i.e. for best case- high temperature.
for worst case - low temperature
Answer of above that why it is so... is in your answer 1...
As Temp Increases ,
Vt (Threshold Voltage) Decreases,
hence Leakage current (Ioff) increases
hence Leakage power increases at Higher Temperatures
and hence slew rates improves... as Ion will be less as Vt is less... and hence delay improves..i.e. delay reduces....

Let me know your views for the same...
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jaydip



Joined: 07 Jun 2008
Posts: 47
Helped: 5


Post16 Oct 2008 18:44   

Re: Answers to Interview Questions


I can agree only partially with Viju.
I am sure that worst case for c65 and below will be at lower temperature(as correctly said by Viju) .. But I am not sure about best case .. I am not sure that weather best case will be at lower temperature (traditional worst case) or at higher temperature (Temperature inversed worst case) .... Can anybody please help here?
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koggestone



Joined: 16 Oct 2008
Posts: 31
Helped: 2


Post17 Oct 2008 11:18   

Re: Answers to Interview Questions


> I would like to comment on your answer 2 and 3. It will be not the case, that you
> have mentioned when we go for 65nm....45 nm... its simply reveres for temperature
>than what you have mentioned...

>Let me know your views for the same

Hi viju , i have updated the answers for 1) and 2) to address your concerns.
hope its clear than before ...
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