hustyw
Joined: 11 Jun 2006
Posts: 14
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 08 Jul 2008 10:19 ibm asic design china |
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================Who we are=================
We, the IBM Chip Design (China) team are the IBM local IC design center in Chi
na of IBM STG MD(Microelectronic Division), which provide IC design
services to the clients all over the world and support IBM internal chip and s
emiconductor development missions.
=============What we do=====================
We provided IC design services to the clients all over the
world and support IBM internal chip and semiconductor development
missions:
-- We help our clients to design PowerPC based SoC design.
-- We provided backend design services (Timing, PD, package, SI,
etc -- ASIC design services in IBM's glossary  )
-- We provided frontend design services(logic design,
verification, FPGA demo, etc.)
-- We also do analog design, circuit design, foundry AE, etc.
=============Position=====================
Job description:
ASIC IO planning and high speed interface design, chip floorplan and power paln, package(laminate) design, image(power bus) creating and verifying.
On die and package power system noise analysis, chip and system cominbational
SI/PI analysis.
Requirements:
Meet at least three items hereunder
1.Package/system design and SI experience.
2.Multiple layer(4+) PCB layout experience.
3.Familiar with phasicall design or SI/PI analysis process.
4.Familiar with Cadence layout/SI tool and Hspice.
5.Good ASIC physical design background knowledge.
If you have interest , pls mail (attach your CV) to:
yinwen372(at)163.com
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