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abhityagi85
Joined: 11 Jan 2008
Posts: 16
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 09 May 2008 8:55 MOUNTING OF SMD COMPONENTS IN RF CIRCUITS (MICs) |
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Hi everybody, This is abhinav, working on rf frontend for sdr
i have a querry regarding mounting of smd components on substrate. how should i do mounting??????? is it different from normal mounting of DIP packages??? if someone can send ur feedback and links related to mounting at abhityagi85(at)gmail.com i shall be greatly thankful.
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melc
Joined: 08 Apr 2005
Posts: 386
Helped: 44
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ckshivaram
Joined: 21 Apr 2008
Posts: 278
Helped: 19
Location: korea
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| 18 May 2008 11:43 Re: MOUNTING OF SMD COMPONENTS IN RF CIRCUITS (MICs) |
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| Soldering SMD components are very difficult and one must need a very good hands on experience experience. Mounting and removing of the component is very difficult. It took 4 years for me to learn the actual soldering of SMD components. For SMD soldering you should always use a temperature control soldering iron and the temperature should not be more than 200 - 250 deg. Only thing never heat the for more amount of time as they will break. just take lead at the tip of the iron. add flux in a very very little quantity, just touch the soldering pad where the component is placed for just 2 or 3 sec. While doing this hold the component with proper tools so that they do not shake while soldering.
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