mamatha123
Joined: 26 Jan 2008
Posts: 1
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 26 Jan 2008 3:07 ic layout |
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1. give one reason why modern mosfets are quite strong, yet very small?
2. give the names of two elements in I.C.manufacturing, which are so-called donars?
3. which of the following layers(s) do not require the Etching step to create in
manufacturing?
4. give two differences between the fielsoxide and the inter level oxide give two
similarities and two differences between an n-well and n+ diffusion?
5. why a step know as annealing is required after the doping?
6. give one benefit why CMP step is used in I.C. manufacturing?
why an n+ is needed to pick up an n-well by a metal1?
7. while via 23 layer is being processed in manufacturing name the layer (pattern)
to which via23 mask will align?
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