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The heat mostly flows through the die back or the die face?

 
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albred



Joined: 01 Aug 2005
Posts: 49
Location: china
Post15 Aug 2006 3:06   The heat mostly flows through the die back or the die face?
Is it the reason that cavity-down package has better thermal performance than cavity-up package?
Thanks.

By the way: Should the package questions be announce here? Razz
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edacw1



Joined: 07 Mar 2004
Posts: 241
Helped: 4
Post17 Aug 2006 14:41   The heat mostly flows through the die back or the die face?
I think it is die face.
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